SEMICONDUCTOR DEVICES

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United States of America Patent

APP PUB NO 20230411472A1
SERIAL NO

18144618

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a substrate; an active region extending in a first direction on the substrate; a gate structure extending in a second direction on the substrate and including a gate electrode; a source/drain region provided on the active region on at least one side of the gate structure; an interlayer insulating layer covering the gate structure; a first contact structure connected to the source/drain region on at least one side of the gate structure; and a gate contact structure passing at least partially through the interlayer insulating layer and connected to the gate electrode, wherein the gate contact structure includes: a first layer including a conductive material; a second layer provided on the first layer, spaced apart from the interlayer insulating layer by the first layer, and including first impurities; and a third layer provided on the second layer and including second impurities.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Jeongik Suwon-si, KR 4 0
LEE, Jaemoon Suwon-si, KR 43 297
LIM, Seongdong Suwon-si, KR 2 0
SHIN, Chunghwan Suwon-si, KR 9 10

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