THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Dec 21, 2023
app pub date -
Sep 6, 2023
filing date -
Jul 30, 2021
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Abstract
A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
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