Manufacturing Method for Optical Unit and Manufacturing Method for Optical Module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230405940A1
SERIAL NO

18210186

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A manufacturing method for an optical unit includes: molding a first wafer in which a plurality of the first optical elements are formed; molding a second wafer in which a plurality of the second optical elements are formed; forming a bonding portion in a first peripheral portion surrounding the first optical element or a second peripheral portion corresponding to the first peripheral portion and surrounding the second optical element; bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element; and cutting the first wafer and the second wafer at the first and second peripheral portions in a state where the first and second wafers are bonded to each other to dice an optical unit, in which the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.

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Patent Owner(s)

Patent OwnerAddress
DAICEL CORPORATION3-1 OFUKA-CHO KITA-KU OSAKA-SHI OSAKA 5300011 ?5300011

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujikawa, Takeshi Tokyo, JP 35 282
Fukui, Sadayuki Tokyo, JP 18 53
Yasuhara, Makoto Tokyo, JP 12 83

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