SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20230405762A1
SERIAL NO

18347464

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510 ?1448510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INOUE, Takuya Tokyo, JP 158 949
KOBATA, Itsuki Tokyo, JP 92 387
MIYAZAKI, Mitsuru Tokyo, JP 83 501
MIZUNO, Toshio Tokyo, JP 48 868
TOYOMURA, Naoki Tokyo, JP 18 80
YAMAGUCHI, Kuniaki Tokyo, JP 47 303

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