SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20230403946A1
SERIAL NO

18239079

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Abstract

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A method for fabricating semiconductor device includes first forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, performing an atomic layer deposition (ALD) process or a high-density plasma (HDP) process to form a passivation layer on the first MTJ and the second MTJ, performing an etching process to remove the passivation layer adjacent to the first MTJ and the second MTJ, and then forming an ultra low-k (ULK) dielectric layer on the passivation layer.

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Patent Owner(s)

Patent OwnerAddress
UNITED MICROELECTRONICS CORPSCIENCE-BASED INDUSTRIAL PARK NO 3 INDUSTRY E ROAD III HSINCHU CITY R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chun-Lung Tainan City, TW 129 867
Gao, Wei-Xin Tainan City, TW 16 3
Hou, Tai-Cheng Tainan City, TW 29 9
Hsieh, Chin-Yang Tainan City, TW 46 103
Huang, Wei-Hao New Taipei City, TW 52 210
Jhang, Jing-Yin Tainan City, TW 73 124
Lai, Yu-Tsung Tainan City, TW 53 258
Laio, Kun-Yuan Hsinchu City, TW 1 0
Li, Chih-Yueh Taipei City, TW 31 91
Li, Kun-Ju Tainan City, TW 51 75
Lu, Chia-Lin Taoyuan City, TW 59 325
Tsai, Bin-Siang Changhua County, TW 102 86
Tsai, Fu-Yu Tainan City, TW 65 72
Wang, Hui-Lin Taipei City, TW 132 187
Weng, Chen-Yi New Taipei City, TW 75 176

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