RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
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United States of America Patent
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Issued Date -
Dec 14, 2023
app pub date -
May 11, 2023
filing date -
Jun 13, 2022
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Abstract
An RF package assembly includes a stacked package-on-package arrangement of a first substrate and a second substrate. Each of the first and second substrates include RF signal pads and ground pads. An interface region between the stacked substrates couples the RF signal pads and ground pads of the first substrate to corresponding pads of the second substrate. The interface region includes galvanic connection regions providing a galvanic connection between the each of the first substrate ground pads and each of the corresponding second substrate ground pads. The interface region includes dielectric regions between each of the first substrate RF signal pads and the corresponding second substrate RF signal pads so that RF signals transmitted between the two substrates are capacitively coupled.
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