PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 14, 2023
app pub date -
Jul 24, 2022
filing date -
Jun 13, 2022
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Abstract
A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.
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