SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Dec 14, 2023
app pub date -
Feb 24, 2023
filing date -
Jun 8, 2022
priority date (Note) -
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Abstract
A semiconductor device includes: a base substrate; a first interlayer insulating layer disposed on the base substrate; a power rail disposed inside the first interlayer insulating layer; an active pattern extended in a first horizontal direction and disposed on the first interlayer insulating layer; a gate electrode extended in a second horizontal direction different from the first horizontal direction and disposed on the active pattern; a gate cut extended in the first horizontal direction and disposed on the power rail, wherein the gate cut separates the gate electrode; and a power rail via disposed inside the gate cut, wherein the power rail via is overlapped by the power rail.
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