POWER MODULE ASSEMBLY
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
May 30, 2023
filing date -
Jun 2, 2022
priority date (Note) -
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Abstract
A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.
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