SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
Aug 21, 2023
filing date -
Jun 28, 2018
priority date (Note) -
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Abstract
A target element to be protected and a protrusion are arranged on a substrate. An insulating film arranged on the substrate covers the target element and at least a side surface of the protrusion. An electrode pad for external connection is arranged on the insulating film. The electrode pad at least partially overlaps the target element and the protrusion as seen in plan view. A maximum distance between the upper surface of the protrusion and the electrode pad in the height direction is shorter than a maximum distance between the upper surface of the target element and the electrode pad in the height direction.
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