SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
Dec 9, 2022
filing date -
Jun 3, 2022
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Abstract
A semiconductor device according to the present embodiment includes a resin layer, ink, and a film. The ink is provided on an upper surface of the resin layer. The film coats the resin layer and the ink. Surface roughnesses of the film are different between in a first region where the ink is provided and in a second region where the ink is not provided.
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