Protector Cap for Package with Thermal Interface Material
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
Aug 17, 2023
filing date -
Feb 27, 2020
priority date (Note) -
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Abstract
A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure, and covering at least part of the interface structure by a protection cap.
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