POLYIMIDE PRECURSOR, POLYIMIDE, AND FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
Nov 11, 2021
filing date -
Nov 10, 2020
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Abstract
Provided are a polyimide precursor which contains a diamine-derived structural unit and a tetracarboxylic dianhydride-derived structural unit, contains a dimer diamine-derived structural unit in an amount of at least 10 mol % but not more than 80 mol % relative to total units of the diamine-derived structural unit, has a weight average molecular weight of at least 15,000 but not more than 130,000, and is used for a base film of a flexible printed circuit board, as well as a resin composition containing the polyimide precursor, and a polyimide obtained using the resin composition.
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