JET SOLDERING APPARATUS
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United States of America Patent
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Issued Date -
Dec 7, 2023
app pub date -
May 9, 2022
filing date -
May 14, 2021
priority date (Note) -
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Abstract
A jet soldering apparatus has a first housing; a first supply port provided on the first housing and configured to provide molten solder; a second housing; and a second supply port provided on the second housing and configured to provide the molten solder. The molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed. The mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.
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