SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

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United States of America Patent

APP PUB NO 20230389288A1
SERIAL NO

18151360

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Abstract

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A semiconductor structure includes a storage chip, a control chip, and a capacitor structure. The storage chip includes an array area. The control chip includes a peripheral area. The control chip and the storage chip are connected in a face-to-face bonding manner. The capacitor structure is located on a surface, away from a bonding surface, of the storage chip. The capacitor structure includes capacitors electrically connected to corresponding transistors in the array area.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INCNO 388 XINGYE AVENUE AIRPORT INDUSTRIAL PARK HEFEI ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE ANHUI PROVINCE 230000 HEFEI CITY ANHUI PROVINCE 230000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CAO, Kanyu Hefei, CN 37 48
LEE, Tzung-Han Hefei, CN 135 609
LIU, Chih-Cheng Hefei, CN 84 445
YANG, Huaiwei Hefei, CN 5 9

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