Method Of Manufacturing A Package Using A Clip Having At Least One Locking Recess
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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
Aug 8, 2023
filing date -
May 16, 2019
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Abstract
A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.
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