PRODUCTION OF SURFACE-MODIFIED CU RIBBONS FOR LASER BONDING
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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
Sep 15, 2021
filing date -
Sep 18, 2020
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Abstract
The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt. % of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.
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