MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL

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United States of America Patent

APP PUB NO 20230383030A1
SERIAL NO

18447502

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A modified fluororesin material containing a modified fluororesin which contains a tetrafluoroethylene unit, a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene, and a tertiary carbon atom. The tertiary carbon atom is present in an amount of 0.001 to 0.030 mol % of a total amount of the tetrafluoroethylene unit and the modifying monomer unit. The modified fluororesin material has a linear expansion coefficient at 20° C. to 200° C. that is 10% or more lower than that of a non-modified fluororesin material. The non-modified fluororesin material contains a tetrafluoroethylene unit and a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene and containing no tertiary carbon atom. Also disclosed is a material for a circuit board including the modified fluororesin material, a laminate for a circuit board, a circuit board, and a method for producing the modified fluororesin material.

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Patent Owner(s)

Patent OwnerAddress
DAIKIN INDUSTRIES LTDOSAKA UMEDA TWIN TOWERS SOUTH 1-13-1 UMEDA KITA-KU OSAKA-SHI OSAKA 5300001 ?5300001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Toshiyuki Osaka, JP 36 253
Imamura, Hitoshi Osaka, JP 40 154
Okanishi, Ken Osaka, JP 14 72
Okuno, Shingo Osaka, JP 46 58
SAWAKI, Kyouhei Osaka, JP 12 29
Ueda, Yuki Osaka, JP 105 215

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