MICROCUT PATTERNED TRANSFER ARTICLES
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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
Nov 30, 2021
filing date -
Dec 2, 2020
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Abstract
A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.
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