MOLDING PACKAGING MATERIAL, POWER STORAGE DEVICE PACKAGING CASE, AND POWER STORAGE DEVICE
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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
Aug 8, 2023
filing date -
Sep 6, 2017
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Abstract
A molding packaging material is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between the two layers. The heat fusible resin layer is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.
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