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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
May 18, 2023
filing date -
May 27, 2022
priority date (Note) -
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Abstract
A substrate includes a heat conduction member including a plurality of carbon nanotubes, a first resin layer provided on first ends of the plurality of carbon nanotubes, and a second resin layer provided on second ends of the plurality of carbon nanotubes, the second ends being opposite the first ends, a first metal layer laminated on the first resin layer, and a second metal layer laminated on the second resin layer, wherein neither the first resin layer nor the second resin layer contains a filler, and wherein spaces between the first ends of the plurality of carbon nanotubes are filled with a resin constituting the first resin layer, and spaces between the second ends of the plurality of carbon nanotubes are filled with a resin constituting the second resin layer.
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