METHOD AND DEVICE FOR CORRECTING PLACEMENT ERROR OF PHOTOMASK

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United States of America Patent

APP PUB NO 20230375917A1
SERIAL NO

17628484

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Abstract

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A method and a device for correcting a placement error of a photomask are provided. The method includes: acquiring an exposure offset during a wafer exposure after photomask manufacture is completed, wherein the wafer exposure is a process of forming a circuit pattern on a wafer surface by exposure; and determining a compensation offset for subsequent photomask manufacture according to the exposure offset, to correct a placement error of a photomask, wherein the compensation offset and the exposure offset are vector values that are equal in value and opposite in direction. The method and device for correcting the placement error of the photomask provided in the embodiments of the present disclosure can reduce an overlay error existing in a photolithography process of a semiconductor device by correcting a placement error of a photomask.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INC230000 ROOM 630 HAI HENG MANSION 6 CUI WEI ROAD HEFEI ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE ANHUI HEFEI CITY ANHUI PROVINCE 230000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KONG, Zhineng Hefei City, Anhui, CN 2 0
ZHANG, Xiuxuan Hefei City, Anhui, CN 2 0

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