Liquid metal infiltration rework of electronic assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12016127
APP PUB NO 20230371221A1
SERIAL NO

18354957

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoffmeyer, Mark K Rochester, US 60 391
Younger, Timothy P Rochester, US 20 27

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