SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Nov 16, 2023
app pub date -
Mar 14, 2023
filing date -
Mar 14, 2023
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Abstract
A semiconductor device includes multiple connecting regions having a second conductivity type and disposed in a cell section and a boundary section. The connecting regions are located between bottom regions and a body region in a thickness direction of a semiconductor layer, in contact with the bottom regions and the body region, and repeatedly arranged at intervals at least in one direction so that a drift region is disposed between the connecting regions.
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