POWER MODULE PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230369186A1
SERIAL NO

18069229

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A power module package is provided. The power module package includes an electronic assembly, a first terminal assembly and a second terminal assembly. The electronic assembly at least includes a substrate. The first terminal assembly includes a first power device terminal, and the second terminal assembly includes a second power device terminal. The first power device terminal and the second power device terminal respectively extend from different surfaces of the substrate to form a height difference therebetween. The first power device terminal includes a first contact section and a first non-contact section. The first contact section is directly connected to the substrate, and the first non-contact section is not in contact with the substrate. The substrate protrudes from the first contact section and extends to a position under the first non-contact section.

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Patent Owner(s)

Patent OwnerAddress
NIKO SEMICONDUCTOR CO LTD12F NO 368 GONGJIAN RD XIZHI DIST NEW TAIPEI CITY 221

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HSIEH, CHIH-CHENG Taoyuan City, TW 40 118
LENG, CHUNG-MING New Taipei City, TW 13 146
Wang, Wei-Lun NEW TAIPEI CITY, TW 7 3
Yang, Hui-Chiang TAIPEI HSIEN, TW 7 17

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