POWER MODULE PACKAGE
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United States of America Patent
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Issued Date -
Nov 16, 2023
app pub date -
Dec 21, 2022
filing date -
Dec 21, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are respectively disposed at two opposite sides of the insulating layer. The power device group is disposed on the circuit pattern layer, and the power device group and the circuit pattern layer are configured to form a common circuit. A total area of the conductive heat-dissipating layer is greater than that of the circuit pattern layer, and a thickness of the circuit pattern layer is greater than that of the insulating layer.
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