EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20230367195A1
SERIAL NO

18225519

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Abstract

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An extreme ultraviolet (EUV) mask includes a multilayer Mo/Si stack comprising alternating Mo and Si layers disposed over a first major surface of a mask substrate, a capping layer made of ruthenium (Ru) disposed over the multilayer Mo/Si stack, and an absorber layer on the capping layer. The EUV mask includes a circuit pattern area and a particle attractive area, and the capping layer is exposed at bottoms of patterns in the particle attractive area.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHENG, Kuotang Hsinchu, TW 4 7
CHIEN, Tsung-Chih Hsinchu, TW 16 17
FU, Chi-Hua Hsinchu, TW 5 15
FU, Shih-Chi Hsinchu, TW 63 369
LEE, Tsung Chuan Hsinchu, TW 13 10
LIU, Bo-Tsun Hsinchu, TW 58 128
SHIH, Chih-Tsung Hsinchu, TW 146 2276

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