Manufacturing Method Of Piezoelectric Element, Piezoelectric Element, And Liquid Droplet Dispensing Head

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United States of America Patent

APP PUB NO 20230354711A1
SERIAL NO

18309864

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Abstract

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A manufacturing method of a piezoelectric element includes: forming a first conductive film on a vibration plate as a substrate; etching a first conductive film; forming a second conductive film on the first conductive film; etching the second conductive film to form a first electrode having a step region as a step formed by the second conductive film and the first conductive film at ends thereof; forming a seed layer as an orientation control layer covering the first electrode by a liquid phase method; forming a piezoelectric film on the seed layer; etching the piezoelectric film to form a piezoelectric body; and forming a second electrode covering the piezoelectric body.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HORIBA, Yasuhiro Shiojiri, JP 16 88
ITAYAMA, Yasuhiro Kai, JP 29 46
TAKEUCHI, Masahiro Chino, JP 96 989

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