SENSOR DEVICES

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United States of America Patent

APP PUB NO 20230353932A1
SERIAL NO

18344905

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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One of the embodiments of the present disclosure provides a sensor device, including: a housing and a transducer unit, wherein the housing has an accommodating cavity inside, the transducer unit includes a vibration pickup structure configured to pick up a vibration of the housing and produce an electrical signal, and the transducer unit in the accommodating cavity separates the accommodating cavity to form a front cavity and a rear cavity on opposite sides of the vibration pickup structure. At least one cavity of the front cavity and the rear cavity is filled with liquid, the liquid is in contact with the vibration pickup structure, and an air cavity is formed between the liquid and the housing.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN SHOKZ CO LTDSHENZHEN

International Classification(s)

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  • 2023 Application Filing Year
  • G01H Class
  • 184 Applications Filed
  • 37 Patents Issued To-Date
  • 20.11 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DENG, Wenjun Shenzhen, CN 51 12
HUANG, Yujia Shenzhen, CN 47 68
LIAO, Fengyun Shenzhen, CN 342 712
QI, Xin Shenzhen, CN 493 1565
YUAN, Yongshuai Shenzhen, CN 58 11
ZHOU, Wenbing Shenzhen, CN 84 85

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Patent Citation Ranking

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1092801 - 1005101520253035404550556065707580859095100105110115

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