SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20230352548A1
SERIAL NO

18219525

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Abstract

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A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate including a trench. The semiconductor device further includes a gate electrode disposed in the trench, and a gate insulating film disposed between the substrate and the gate electrode. The gate electrode includes a gate conductor and a metal element, and an effective work function of the gate electrode is less than an effective work function of the gate conductor.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Eunae Seoul, KR 28 74
HEO, Sung Suwon-si, KR 21 85
JEONG, Moonyoung Suwon-si, KR 38 40
JUNG, Kyoung-Ho Suwon-si, KR 13 88
KIM, Sungjin Suwon-si, KR 303 1065
KIM, Yongsu Seongnam-si, KR 22 67
KO, Dong Su Seoul, KR 6 18
LEE, Dongjin Soul, KR 95 570
LEE, Ji Eun Suwon-si, KR 149 758
LIM, Han Jin Seoul, KR 31 96
PARK, Gyeongsu Hwaseong-si, KR 9 22
PARK, Hyun Siwon-si, KR 62 487
YAMADA, Satoru Seoul, KR 284 4701
YOO, Jiho Suwon-si, KR 22 78

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