POWER SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR ELEMENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 2, 2023
app pub date -
Apr 27, 2021
filing date -
Jun 15, 2020
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A power semiconductor module includes a power semiconductor element. In order to reduce the required installation space of the power semiconductor module and to increase the service of the power semiconductor module, the power semiconductor element is connected in an electrically insulating and thermally conductive manner to a cooling element via a dielectric material layer. The dielectric material layer is laid flat on a surface of the cooling element and force-lockingly connected to the cooling element by a first force acting orthogonal to the surface of the cooling element.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully