MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL
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United States of America Patent
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Issued Date -
Oct 26, 2023
app pub date -
Mar 24, 2023
filing date -
Apr 20, 2022
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Abstract
Multichip module thermal management through backside metal systems and methods are disclosed. In one aspect, a multichip module includes one or more flip chip integrated circuits (ICs), each having a backside to which a metal heat conductor or spreader is attached. The presence of the metal heat conductor on the backside of the flip chip ICs allows for a better thermal path to remove heat from the ICs relative to the substrate. The improved thermal path reduces the likelihood of damage to the ICs or delamination of the module. A variety of methods are proposed to construct the backside metal systems. Additionally, a variety of capture features may be used to assist in structural integrity.
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