COMPOSITION FOR SEMICONDUCTOR PROCESSING AND POLISHING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Oct 19, 2023
app pub date -
Apr 7, 2023
filing date -
Apr 13, 2022
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Abstract
A composition for semiconductor processing, includes abrasive particles surface-modified with an amino silane-based compound; a copper erosion inhibitor, including an azole-based compound; a copper surface protectant, including a compound having a betaine group and a salicylic group or a derivative thereof; and a surfactant, including fluorine in a molecule thereof. A surface of the surface-modified abrasive particles comprises an amino silane group.
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