Importance

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Abstract

This alignment device aligns a stage 10 and a wafer 50 by comparing alignment images captured by respective two chips of the wafer 50 on the stage 10. The alignment device comprises: the stage 10 that holds the wafer 50; an alignment illumination light source 60 that irradiates the wafer 50 held on the stage 10 with light; an alignment image processing unit 67 that receives light from the wafer 50 and acquires the alignment images; an information input/output unit 4 that inputs and outputs information; and an alignment processing unit 3 that processes information from the image processing unit 67 for alignment and the information input/output unit 4. The alignment processing unit 3 sets an alignment image captured on a first wafer as a reference image, quantifies, on the basis of a difference obtained by comparing the reference image with an alignment image captured on a second wafer, sequential change information of a wafer surface state from a time when the first wafer is captured to a time when the second wafer is captured, and displays the quantified sequential change information on the information input/output unit 4.

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First Claim