MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT BOARD

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United States of America Patent

APP PUB NO 20230326682A1
SERIAL NO

18192515

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer ceramic electronic component includes a ceramic body that has internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, the internal electrodes being alternately led out to the end surfaces, and external electrodes covering the end surfaces of the ceramic body, wherein each of the external electrodes includes a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes, a first Ni film formed on the base film, a metal film that is formed on the first Ni film and contains a metal having a lower ionization tendency than Ni, as a main component, a second Ni film formed on the metal film and having a higher hydrogen concentration than the first Ni film, and a surface layer film formed on the second Ni film.

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Patent Owner(s)

Patent OwnerAddress
TAIYO YUDEN CO LTD7-19 KYOBASHI 2-CHOME CHUO-KU TOKYO 1040031 ?1040031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKAI, Tomoki Tokyo, JP 18 234

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