MULTILAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Oct 12, 2023
app pub date -
Mar 21, 2023
filing date -
Apr 12, 2022
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Abstract
A multilayer ceramic electronic component includes a ceramic body having internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, and external electrodes covering the end surfaces of the ceramic body, respectively, wherein each of the external electrodes includes a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes that are led out to the corresponding end surface, a first Ni film formed on the base film, a second Ni film formed on the first Ni film, a surface layer film formed on the second Ni film, and a metal film that is formed between the first Ni film and the second Ni film and contains a metal having a Young's modulus lower than that of Ni, as a main component.
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