METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME
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United States of America Patent
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Issued Date -
Oct 12, 2023
app pub date -
Sep 6, 2022
filing date -
Apr 6, 2022
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Abstract
A method of manufacturing a semiconductor chip includes; generating a layout pattern, performing Process Proximity Correction (PPC) on the layout pattern to generate a PPC layout pattern, wherein the performing of PPC includes verifying the PPC layout pattern using machine learning, performing Optical Proximity Correction (OPC) on the PPC layout pattern to generate an OPC layout pattern, manufacturing a mask using the OPC layout pattern, and manufacturing a semiconductor chip using the mask.
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