Flux and solder paste

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United States of America Patent

PATENT NO 11986909
APP PUB NO 20230321767A1
SERIAL NO

18036940

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Abstract

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The present invention uses a flux containing a rosin, a solvent, a thixo agent, and an activator. The thixo agent contains a polyamide and a compound represented by general formula (1). The polyamide is a condensate between an amine and at least one selected from aliphatic carboxylic acids and hydroxy group-containing aliphatic carboxylic acids, and has an endothermic peak at a temperature of 120-200° C. In the general formula, R11 represents a hydrocarbon group having 11-30 carbon atoms. R0a represents a hydrogen atom or a hydrocarbon group having 12-31 carbon atoms. R0b represents an n-valent hydrocarbon group having 4-12 carbon atoms. R21 represents an alkylene group having 2-6 carbon atoms. R0c represents a single bond or an alkylene group having 2-6 carbon atoms. n represents 1 or 2. When n represents 1, m represents an integer of 1-3. When n represents 2, m represents 1.

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Patent Owner(s)

  • SENJU METAL INDUSTRY CO. LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Kenta Tokyo, JP 18 29
Miyagi, Nanako Tokyo, JP 4 5
Nagai, Tomoko Tokyo, JP 4 2
Takagi, Kazuyori Tokyo, JP 6 12
Takaki, Akiko Tokyo, JP 4 2

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