DEPOSITION METHODS AND APPARATUS FOR PIEZOELECTRIC APPLICATIONS

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United States of America Patent

APP PUB NO 20230320223A1
SERIAL NO

18022652

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Disclosed are methods and apparatus for depositing uniform layers on a substrate (201) for piezoelectric applications. An ultra-thin seed layer (308) having a uniform thickness from center to edge thereof is deposited on a substrate (201). A template layer (310) closely matching the crystal structure of a subsequently formed piezoelectric material layer (312) is deposited on a substrate (201). The uniform thickness and orientation of the seed layer (308) and the template layer (310), in turn, facilitate the growth of piezoelectric materials with improved crystallinity and piezoelectric properties.

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APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KADAM, Ankur Thane, IN 24 679
PAI, Uday San Jose, US 13 59
PATIL, Nilesh Mumbai, IN 16 23
RAMAKRISHNAN, Bharatwaj Sunnyvale, US 12 44
SANGLE, Abhijeet Laxman Mumbai, IN 11 5
SHARMA, Vijay Bhan Mumbai, IN 13 33
XUE, Yuan Xi'an, CN 52 151

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