POLISHING COMPOSITION, AND POLISHING METHOD USING POLISHING COMPOSITION

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United States of America Patent

APP PUB NO 20230312983A1
SERIAL NO

18018093

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a polishing composition capable of speeding up a mirror polishing in terms of polishing rate and the like, improving the smoothness and the flatness of a wafer surface of a semiconductor wafer after the mirror polishing, enabling mirror finishing with high processing accuracy, and having excellent storage stability.

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Patent Owner(s)

Patent OwnerAddress
YAMAGUCHI SEIKEN KOGYO CO LTD1631 SHIMIZUYAMA 2-CHOME MIDORI-KU NAGOYA-SHI AICHI 4598009

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GOTO, Yuji Aichi, JP 44 228
HARAGUCHI, Tetsuro Aichi, JP 2 8
HORIMOTO, Sanaki Aichi, JP 6 52
SUGAWA, Akira Aichi, JP 5 10

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