ENVELOPE PROCESSING APPARATUS AND IMAGE FORMING SYSTEM

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United States of America Patent

APP PUB NO 20230311561A1
SERIAL NO

18174919

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An envelope processing apparatus inserts an enclosure into an envelope and includes a first conveyor, a first ejector, a second conveyor, a second ejector, and circuitry. The first conveyor conveys the enclosure to an enclosing position. The envelope in which the enclosure is enclosed is ejected to the first ejector. The second conveyor conveys the envelope to the enclosing position via an envelope conveyance passage extended in a substantially vertical and up-and-down direction and conveys the envelope in which the enclosure is inserted to the first ejector. The second ejector is separate from the first ejector. The enclosure is ejected to the second ejector. The circuitry controls a conveyance operation of the first conveyor and the second conveyor.

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Patent Owner(s)

Patent OwnerAddress
RICOH COMPANY LTDTOKYO

International Classification(s)

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  • 2023 Application Filing Year
  • B43M Class
  • 16 Applications Filed
  • 6 Patents Issued To-Date
  • 37.50 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuda, Takahiro Kanagawa, JP 160 1766
Morinaga, Takuya Tokyo, JP 64 766
Shibasaki, Yuusuke Tokyo, JP 68 750
Shinoda, Atsushi Kanagawa, JP 26 48
Suzuki, Michitaka Kanagawa, JP 65 1182
Suzuki, Nobuyoshi Tokyo, JP 186 3968
Watanabe, Takahiro Kanagawa, JP 232 2355
Yoshizawa, Shingo Kanagawa, JP 27 20

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Patent Citation Ranking

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  • B43M Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges34401 - 10024681012141618202224262830323436

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