Optical sensor package assembly
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United States of America Patent
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Issued Date -
Sep 28, 2023
app pub date -
Mar 22, 2023
filing date -
Mar 22, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides an optical sensor package assembly. The light shield is arranged in the groove of a package housing above the photosensitive chip. The connection wires between the substrate, the light emitting unit and the photosensitive chip can be printed or disposed on the surface of the substrate. Further, a distance between the photosensitive element and the chip edge is designed to reduce or avoid side leakage interference.
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