METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) OBJECT PRINTER TO FORM VIAS IN PRINTED CIRCUIT BOARDS WITH CONDUCTIVE METAL
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United States of America Patent
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Issued Date -
Sep 28, 2023
app pub date -
May 17, 2023
filing date -
Jan 22, 2021
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Abstract
A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.
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