SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 28, 2023
app pub date -
Sep 12, 2022
filing date -
Mar 22, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
According to one embodiment, a semiconductor device includes a package substrate including a package member and a first conductive portion; a semiconductor package provided on a first surface of the package substrate inside the package member and coupled to the first conductive portion; a first semiconductor chip provided on the first surface of the package substrate inside the package member and including a first terminal; a second semiconductor chip provided on the first surface of the package substrate inside the package member and including a second terminal; and a connection component that couples the first and second terminals to the first conductive portion inside the package member.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully