SENSING ELEMENT AND RELATED METHODS
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United States of America Patent
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Issued Date -
Sep 28, 2023
app pub date -
Mar 23, 2022
filing date -
Mar 23, 2022
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Abstract
A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device formed mainly from a silicon substrate and having a microelectromechanical system without the use of quartz or polymer, wherein the at least one acoustic sensing device detects a torque associated with a metal object subject to said torque, and a high temperature bonding surface for directly connecting the sensing element to the metal object via a high temperature connecting processes comprising at least one of soldering, metalizing and/or brazing, without the need for a polymer adhesive. Related sensors using such sensing elements and methods are also disclosed herein.
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