MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
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United States of America Patent
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Issued Date -
Sep 21, 2023
app pub date -
Nov 4, 2022
filing date -
Jan 21, 2022
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Abstract
A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface; and a porous plug that is disposed in a plug insertion hole penetrating the ceramic plate in a up-down direction, and allows a gas to flow, wherein the porous plug has a first porous member exposed to the wafer placement surface, and a second porous member having an upper surface covered by the first porous member, the first porous member is higher in purity and smaller in thickness than the second porous member, and the second porous member is higher in porosity than the first porous member.
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