TEMPERATURE MEASUREMENT DEVICE, TEMPERATURE MEASUREMENT METHOD, AND TEMPERATURE ATTENUATION MEASUREMENT METHOD

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United States of America Patent

APP PUB NO 20230296447A1
SERIAL NO

18010198

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Abstract

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A temperature measurement device (10) comprises: a thermosensitive unit (41) that senses temperature; a thin film thermosensitive element (1) for measurement capable of measuring the temperature by bringing the thermosensitive unit (41) into contact with a subject; a thin film thermosensitive element (2) for protective heating disposed to enable heat exchange with the thin film thermosensitive element (1) via an insulating layer (S1), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (1); a temperature control element (3) capable of causing the thin film thermosensitive element (1) to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit (5) controlling the thin film thermosensitive element (1), the thin film thermosensitive element (2), and the temperature control element (3).

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Patent Owner(s)

Patent OwnerAddress
SEMITEC CORPORATION7-7 KINSHI 1-CHOME SUMIDA-KU TOKYO 1308512 ?1308512

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIGASHI, Masaya Tokyo, JP 5 13
HOSOKAWA, Yasushi Aomori, JP 3 0
ISEKI, Yuya Aomori, JP 3 0
KOGAWA, Takuma Aomori, JP 3 0
MARUYAMA, Shigenao Aomori, JP 9 23
MATSUDATE, Tadashi Tokyo, JP 6 45
NAKAJIMA, Toshinori Tokyo, JP 2 0
NONAKA, Takashi Aomori, JP 79 459
OKABE, Takahiro Aomori, JP 29 261
ORITO, Manabu Tokyo, JP 8 147
TABATA, Yutaro Tokyo, JP 3 0

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