SILICON NITRIDE ETCHING COMPOSITION AND METHOD
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United States of America Patent
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Issued Date -
Sep 21, 2023
app pub date -
May 24, 2023
filing date -
Nov 15, 2018
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Abstract
Compositions useful for the selective removal of silicon nitride materials relative to polysilicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon are provided. The compositions of the invention are particularly useful in the etching of 3D NAND structures.
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