EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME
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United States of America Patent
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Issued Date -
Sep 21, 2023
app pub date -
May 25, 2023
filing date -
Jan 11, 2018
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Abstract
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
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