Imprint method, method of manufacturing semiconductor device, and imprint device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12072622
APP PUB NO 20230288797A1
SERIAL NO

17897030

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Abstract

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According to one embodiment, an imprint method for a substrate having a plurality of shot regions includes performing a first process on each target shot region in the plurality of shot regions and performing a second process on a non-target shot region in the plurality of shot regions. The first process includes pressing a template against resin in the target shot region to transfer a pattern to the resin, curing the resin, and releasing the template from the cured resin while supplying inert gas towards the substrate from an outer edge side of the template. The second process includes causing the template to approach the non-target shot region without coming into contact with resin in the non-target shot region, and moving the template away from the resin in the non-target shot region while supplying inert gas towards the substrate from the outer edge side of the template.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO 1080023 ?1080023

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatano, Masayuki Yokkaichi Mie, JP 53 397
Miyoshi, Hirokazu Yokkaichi Mie, JP 5 36

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